Latest about HBM
Samsung debuts three next-generation memory technologies for AI data centers
Free Premium Article Samsung uses FMS to unveil three next-generation memory technologies — zHBM, zNAND-O, and BV-NAND — that target different markets, but all rely on advanced wafer-bonding techniques.
DRAM chip supply to memory module makers could drop by more than 70% in 2027, says Apacer CEO
Apacer warns DRAM allocations to module makers could fall below 30% of 2026 levels as AI demand tightens supply and pushes memory prices higher.
Researchers turn HBM on its side to tackle AI memory’s heat wall
Technologies not yet proven as viable HBM alternatives
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
Micron inks long-term supply agreements worth $100 billion
Micron has signed 16 LTAs with various customers to supply DRAM and NAND worth $100 billion.
Qualcomm reveals HBC near-memory AI architecture, AI250 and AI350 accelerators
Qualcomm unveils HBC near-memory AI architecture, claims it has broken the memory wall.
SK hynix passes Samsung as South Korea's most valuable company
SK hynix overtook Samsung Electronics on Monday to become South Korea’s most valuable listed company.
Industry coalition urges Trump administration to take urgent action as AI data centers' extreme memory consumption threatens other industries
Risks are emerging despite billions of dollars of US investment in domestic semiconductor supply chains
