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enter image description here

I am trying to breakout the pins from an FFC receptacle that connects to a 7 inch TFT LCD touch screen to header pins. This is part of a board that I'm designing which is meant to create a working touchscreen that I can flash code to and connect to via Wifi. Not in this picture are the other components (SSD1963, ESP32, Clk etc.). I have messed up circuit boards before in the early stages of prototyping, hence I am designing this board to be able to be broken up and be used as individual breakout boards and breadboarded in the event that does happen.

I am asking for a critique of my routing technique. Most of my signals are around 40MHz of frequency. Is there any better way of breaking out the FFC into header pins?

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There are some rooms for improvement.

The bottom layer

Because your signals are not "DC only" but toggling at 40MHz, you have to consider the return currents.

Long story short: Put a continuous GND plane that fills completely the bottom layer. It's also important that the GND pins at the screen connectors and at the single row headers are connected to that GND plane and you have to remove the GND traces and only use the GND plane for your GND.

Yes, your breakout board will be specific to that screen and not fully generic.

Routing parallel traces

Your traces are way too close. The more distance you put between them, the less unwanted coupling you get. I suggest that you try to increase as much as you can the clearance distance between your traces and put them as further appart as you can.

Breadboarding high speed signals

I am fundamentally worried about using breadboard for high-speed digital signals. My rule of thumb is "above 10MHz forget about using a breadboard".

Why are we breadboarding in the first place? To test ideas, validate our design and check for problems quickly and at low cost. And then you can build your PCB. This is fine for low speed (less than 10MHz). But here, the breadboard will have a significant impact on the circuit. You will observe issues related to the breadboard itself and not issues of your design that would be fine if it were on a PCB.

My advice is to skip the breadboarding completely. Enter your design directly in your CAD and then ask for a review. If your schematics is carefully drawn, you can post it on this site, and we may help you for the review.

Most issues can be identified by reviewing the schematics. Only layout-related issues cannot. However, a breadboard won't help you catch layout issues either... If your breakout board is intended solely for easy access to signals during debugging, it's better to use test points instead.

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  • \$\begingroup\$ Or if you must use headers, assign every other pin GND, and then the signal is relatively safe to carry on ribbon cable, for example, and related connectors. || "Your traces are way too close" -- I'm curious what you think the FFC side looks like, and for what length! The length of close spacing here is inoffensive to me. Even min spaced microstrip traces have very modest coupling to each other, tolerable for general digital purposes. Overall length, and impedance mismatch, are the bigger concern here (which likely rules out ribbon cable, and solderless breadboards). \$\endgroup\$
    Tim Williams
    –  Tim Williams
    2025-10-16 15:03:08 +00:00
    Commented 7 hours ago
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Not in this picture are the other components (SSD1963, ESP32, Clk etc.). I have messed up circuit boards before in the early stages of prototyping, hence I am designing this board to be able to be broken up and be used as individual breakout boards and breadboarded in the event that does happen.

There is an alternative strategy. If you're prone to messing up pinouts, you can route a bus from e.g. display controller to connector, with jumper resistors in series. That might look like so:

enter image description here

(Own work.) This was a display controller (FT800 I think?) sending 24-bit parallel video to an FFC connector.

This design was driven by two instructions:

  1. Series resistors where possible, either to jumper for patching of prototypes, or for source termination of logic signals
  2. Test points on every node so that component assembly can be tested automatically (flying probe)

With top-side placement and routing, test points mostly look like vias here. I think I didn't use bottom-side SMT test pads at all back then, actually; I would've added those to the library not long after this board was made.

Speaking of test points, if you want to get actual wire into the pad, I'd recommend 0.5-1.0mm ID; the low end is enough for fine wire, enameled, wirewrap, etc.; the upper end fits most component leads, header strip, etc. If in an array (like this), placing them on a regular grid 2.54mm allows header installation. (Or something else nearby and convenient; 2mm would also work, and 2mm header is readily available. Finer pitch, I'd recommend against; it's less available, and harder to use.) Do make considerations, like every-other grounded, particularly on relatively fast signals like this.

These test points might even be 0.3mm ID, which is still enough to fit wirewrap wire (30 AWG), if a bit fiddly; but the resistor pads (0805s at that) are easy enough to tack a wire onto, which we did from time to time.

Note the design: the board is 2-layer, ground plane poured on both sides, stitched with vias (you can just see the dark, tented vias around the bus here, around the top-left bus, connectors, etc.), which makes traces into microstrip transmission line, which has predictable impedance and propagation velocity. Where buses cross, overlap area is kept to a minimum, and stitching vias are placed all around the crossing to minimize ground-return path length. (There's nothing routed under this video bus, of course; the controller's SPI interface is routed underneath the top-left bus, around R87-R85.)

Even if long jumper wires need to be routed over such a board, they will also manifest as microstrip (in this case, some hybrid-dielectric, round wire over plane, geometry; basically the same characteristics as planar microstrip). It's typical to glue such wires down to the board, enforcing a low height above plane -- you even see boards (moreso back in the day, 70s to 90s) with such wires, in production -- it's not the end of the world, to have a few jumpers, anyway. (Less so today, what with validation tools, and PCB fab costs being so low, not to mention consumer product density so high you can't get a patch wire in anywhere anyway. But there's still niche stuff like this where it can happen, at least in prototype quantities like this exact board was.)

You can't apply this practice fully everywhere; high-pin-count devices, it gets very tedious (as you can see here!). Decide if a compromise is necessary, or check the pinout and signal type/level obsessively to direct wire it. Don't jumper out power pins: verify and triple-check them against the datasheet instead; you need the short path length to nearby bypass capacitor or ground plane. (As consolation, you could still leave a short stub track, which can be cut with a craft knife, and the soldermask scraped away to expose solderable copper. Patching becomes more tedious, but you've made sure it's very unlikely to need.)

Alternately, boards are cheap. Just wing it. It costs a couple weeks time, and not much budget these days, to spin another board. If it's not a professional project, just something you're whacking together, time is easy to write off.

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